FLOOXS » Test Decks

Test Decks

664 deck(s) under Test/, grouped by category.

BadInput (23)

• Test/BadInput/bad_alagator_densenn_arity.tcl — Alagator densenn() with wrong input arity (model in_dim != args count)
• Test/BadInput/bad_alagator_densenn_multi_out.tcl — Alagator densenn() with a multi-output model is rejected — alagator
• Test/BadInput/bad_alagator_densenn_unknown.tcl — Alagator densenn("name", ...) referencing a model that isn't registered
• Test/BadInput/bad_alagator_tspline_arity.tcl — Alagator tspline() with input arity != table's axis count must
• Test/BadInput/bad_alagator_tspline_unknown.tcl — Alagator tspline("name", ...) referencing a table that isn't registered
• Test/BadInput/bad_contact_flux_unknown_sol.tcl — bad_contact_flux_unknown_sol.tcl — contact flux with sol= naming a non-existent solution
• Test/BadInput/bad_contact_underscore_name.tcl — bad_contact_underscore_name.tcl — contact name= containing an underscore
• Test/BadInput/bad_flash_no_args.tcl — bad_flash_no_args.tcl — bare `flash` with no movie= argument
• Test/BadInput/bad_implant_no_args.tcl — bad_implant_no_args.tcl — implant called with no arguments at all
• Test/BadInput/bad_init_no_region.tcl — bad_init_no_region.tcl — init called with line commands but no region defined
• Test/BadInput/bad_interpolate_no_field.tcl — bad_interpolate_no_field.tcl — interpolate called without a prior sel
• Test/BadInput/bad_machine_no_args.tcl — bad_machine_no_args.tcl — bare `machine` with no name=
• Test/BadInput/bad_mask_no_args.tcl — bad_mask_no_args.tcl — mask called with no parameters
• Test/BadInput/bad_mater_alias_no_name.tcl — bad_mater_alias_no_name.tcl — `mater alias=Foo` without `name=`
• Test/BadInput/bad_mater_inherit_no_name.tcl — bad_mater_inherit_no_name.tcl — `mater inherit=Silicon` without `name=`
• Test/BadInput/bad_mater_no_args.tcl — bad_mater_no_args.tcl — bare `mater` with no arguments
• Test/BadInput/bad_newregrid3d_1d_mesh.tcl — bad_newregrid3d_1d_mesh.tcl — `newregrid3d` on a 1D mesh
• Test/BadInput/bad_newton_empty_eqn.tcl — bad_newton_empty_eqn.tcl — newton with valid var but an empty eqn string
• Test/BadInput/bad_newton_undefined_var.tcl — bad_newton_undefined_var.tcl — newton with var= referring to a solution that doesn't exist
• Test/BadInput/bad_newton_unknown_field.tcl — bad_newton_unknown_field.tcl — newton with valid var but eqn referencing an undefined symbol
• Test/BadInput/bad_pen_no_args.tcl — bad_pen_no_args.tcl — bare `pen` with no name= argument
• Test/BadInput/bad_region_zero_extent.tcl — bad_region_zero_extent.tcl — region with xlo == xhi (zero-extent)
• Test/BadInput/bad_test_adapt_1d_mesh.tcl — bad_test_adapt_1d_mesh.tcl — `test_adapt` on a 1D mesh

Coverage (425)

• Test/Coverage/cov_2d_diffuse_interface.tcl — 2D diffusion with multi-material interface
• Test/Coverage/cov_2d_refine_facecentroid.tcl — 2D internal refine: face (Tri) centroid point insertion. In 2D the
• Test/Coverage/cov_3d_adapt_remove.tcl — 3D mesh with diffusion and grid adaptation
• Test/Coverage/cov_3d_diffuse.tcl — Test 3D diffuse solve (exercises 3D element assembly paths)
• Test/Coverage/cov_3d_diffuse_tet.tcl — 3D diffusion on tetrahedral mesh
• Test/Coverage/cov_3d_etch_options.tcl — 3D etch with internal and tetgen meshing options
• Test/Coverage/cov_3d_extended_ops.tcl — Exercise 3D mesh operations, struct write, and grid queries
• Test/Coverage/cov_3d_geometry.tcl — cov_3d_geometry.tcl -- Exercise 3D geometry paths in Tet.cc, Pent.cc, Brick.cc, Volume.cc
• Test/Coverage/cov_3d_mesh_ops.tcl — Test 3D mesh element operations (Brick, Face, Edge paths)
• Test/Coverage/cov_3d_multi_region.tcl — 3D multi-region mesh with interface
• Test/Coverage/cov_3d_multiregion_write.tcl — Exercise 3D multi-region struct write and element iteration
• Test/Coverage/cov_3d_refine_internal.tcl — 3D internal refine: volume + face centroid point insertion (default
• Test/Coverage/cov_3d_refine_reduce.tcl — 3D internal refine (edge-split + reduce) and Prism element test
• Test/Coverage/cov_3d_tet_mesh.tcl — 3D tetrahedral mesh operations
• Test/Coverage/cov_ac_iterative.tcl — AC solver with iterative (BiCGStab) instead of direct (UMF)
• Test/Coverage/cov_ac_solver.tcl — Minimal AC (small-signal) solver test
• Test/Coverage/cov_adapt_delaunay.tcl — Test 2D mesh adaptation with Delaunay refinement
• Test/Coverage/cov_adapt_distance.tcl — Test Adapt distance computation and grid loop paths
• Test/Coverage/cov_adapt_edgecoll.tcl — Test mesh adaptation with edge collapse and refinement via C++ harness
• Test/Coverage/cov_adapt_gridadd.tcl — Test GridAdd and GridAddPerp paths during levelset deposit
• Test/Coverage/cov_adapt_interior.tcl — Test interior (non-skeletal) AdaptRefine path via C++ test harness
• Test/Coverage/cov_adapt_refine_1d.tcl — Test AdaptRefine + CollapseAllowed scoring via C++ test harness
• Test/Coverage/cov_adapt_remove.tcl — Test mesh adaptation triggered by diffusion regrid
• Test/Coverage/cov_adapt_split.tcl — Exercise Mesh::Split and Mesh::Glue paths
• Test/Coverage/cov_airy.tcl — cov_airy.tcl — coverage test for src/math/airy.cc
• Test/Coverage/cov_alagator_densenn.tcl — cov_alagator_densenn.tcl — embed a trained densenn inside an alagator
• Test/Coverage/cov_alagator_floor.tcl — cov_alagator_floor.tcl -- floor() and ceil() in Alagator.
• Test/Coverage/cov_alagator_hyperbolic.tcl — cov_alagator_hyperbolic.tcl -- hyperbolic functions in Alagator.
• Test/Coverage/cov_alagator_tspline.tcl — cov_alagator_tspline.tcl — embed a tspline table inside an alagator PDE
• Test/Coverage/cov_algan_eqns.tcl
• Test/Coverage/cov_animesh_cubic.tcl — Exercise AniMesh::InterpolateCubic via the `anicubic` Tcl wrapper.
• Test/Coverage/cov_aschro_field_coeff.tcl — DataField coefficient in complex H= assembly path coverage
• Test/Coverage/cov_aschro_high_order.tcl — Higher-order aschro coverage
• Test/Coverage/cov_avgstress_3d.tcl — averagestress3d and peak command coverage
• Test/Coverage/cov_basedata_node_ops.tcl — Exercise BaseData and Node operations
• Test/Coverage/cov_basedata_setname_collision.tcl — BaseData::SetName cross-type collision guard
• Test/Coverage/cov_bc_types.tcl — Test various boundary condition types
• Test/Coverage/cov_bem_1d.tcl — BEM Laplace test — 2D oxide-only
• Test/Coverage/cov_bem_3d.tcl — 3D BEM Laplace infrastructure test
• Test/Coverage/cov_blasbcgs.tcl — Test BLAS-based BiCGStab solver path
• Test/Coverage/cov_block_precond.tcl — Test block-diagonal preconditioner (math/block.cc)
• Test/Coverage/cov_boundary_types.tcl — cov_boundary_types.tcl -- Exercise boundary condition paths in Genbc.cc and EleBoundInfo.cc
• Test/Coverage/cov_brick2tet.tcl — Cov-Brick2Tet — exercise the internal Brick→Tet decomposition.
• Test/Coverage/cov_btbt.tcl — Minimal band-to-band tunneling test (Germanium, one bias point)
• Test/Coverage/cov_calcstress_3d.tcl — 3D mesh operations for geometry coverage
• Test/Coverage/cov_circuit_ac.tcl — cov_circuit_ac.tcl — AC small-signal analysis of an RC circuit
• Test/Coverage/cov_circuit_dc.tcl — cov_circuit_dc.tcl — standalone DC circuit solver coverage test
• Test/Coverage/cov_circuit_ddt_ac.tcl — cov_circuit_ddt_ac.tcl — RC AC at three different frequencies WITHOUT
• Test/Coverage/cov_circuit_inductor.tcl — cov_circuit_inductor.tcl — RL step response (validates `flux` + ddt(flux))
• Test/Coverage/cov_circuit_mesh.tcl — cov_circuit_mesh.tcl — circuit-mesh interface via voltage contacts
• Test/Coverage/cov_circuit_mesh_ac.tcl — cov_circuit_mesh_ac.tcl — mesh-coupled AC small-signal analysis
• Test/Coverage/cov_circuit_mesh_transient.tcl — cov_circuit_mesh_transient.tcl — mesh-coupled transient analysis
• Test/Coverage/cov_circuit_nonlin_converge.tcl — cov_circuit_nonlin_converge.tcl — regression for the Newton circuit-node
• Test/Coverage/cov_circuit_supply.tcl — cov_circuit_supply.tcl -- direct regression for `circuit supply`.
• Test/Coverage/cov_circuit_transient.tcl — cov_circuit_transient.tcl — BDF1 transient analysis of an RC circuit
• Test/Coverage/cov_complex.tcl — Exercise complex-number expression evaluation in sel: real(), imag(),
• Test/Coverage/cov_complex_abs_rqi.tcl — Coverage test for:
• Test/Coverage/cov_complex_ac.tcl — ============================================================================
• Test/Coverage/cov_complex_autodetect.tcl — Complex Newton solve with auto-detection — no "math diffuse complex"
• Test/Coverage/cov_complex_eigen.tcl — Test Eigen sparse solver variants — real and complex
• Test/Coverage/cov_complex_mesh_adapt.tcl — Cov-ComplexMeshAdapt — bring ComplexData fields through mesh-adapt and
• Test/Coverage/cov_complex_newton.tcl — Complex Newton solve — exercises UMFComplex, complex matrix assembly,
• Test/Coverage/cov_complex_pde.tcl — ============================================================================
• Test/Coverage/cov_comprow_matrix.tcl — Test CompRowMatrix paths
• Test/Coverage/cov_contact_current.tcl — cov_contact_current.tcl -- CURRENT-mode contact end-to-end.
• Test/Coverage/cov_contact_flux_compare.tcl — Compare Newton flux vs gradient-integral flux using FEQF on a 2D N-type resistor
• Test/Coverage/cov_contact_flux_methods.tcl — cov_contact_flux_methods.tcl — verify equivalence of the two flux
• Test/Coverage/cov_contact_integrate.tcl — Contact integrate= and normal= coverage test
• Test/Coverage/cov_contact_network.tcl — cov_contact_network.tcl -- NETWORK-mode contact wired to SPICE network.
• Test/Coverage/cov_context_dump.tcl — Cov-ContextDump — exercise the LLM context-bundle generator
• Test/Coverage/cov_continuous_mimic_1d.tcl — Mimic the `continuous` solution flag with explicit interface equations.
• Test/Coverage/cov_continuous_mimic_2d.tcl — 2D version of the mimic-continuous demonstration.
• Test/Coverage/cov_continuous_mimic_3d.tcl — 3D version of the mimic-continuous demonstration.
• Test/Coverage/cov_coordinate_ops.tcl — Test Coordinate.cc and AniMesh.cc paths
• Test/Coverage/cov_coupled_pde_2var.tcl — Coupled 2-variable PDE with nonlinear terms
• Test/Coverage/cov_crossconnect_2d.tcl — CrossConnect 2D surface field server construction
• Test/Coverage/cov_debug_write_paths.tcl — Exercise write/BuildString paths via options debug
• Test/Coverage/cov_densenn.tcl — cov_densenn.tcl — coverage for src/analysis/nn/densenn.cc
• Test/Coverage/cov_device_bandgap.tcl — Doping profile operations
• Test/Coverage/cov_device_doping_types.tcl — Device simulation with doping profile setup
• Test/Coverage/cov_diffcontrol_modes.tcl — Exercise DiffControl.cc paths: ramp rate, userstep, damp.trbdf, reload
• Test/Coverage/cov_diffuse_adapt_damp.tcl — Test DiffController adaptation and TRBDF damping paths
• Test/Coverage/cov_diffuse_anisotropic.tcl — Diffusion with material property variation
• Test/Coverage/cov_diffuse_dirichlet.tcl — Diffusion with Dirichlet boundary conditions
• Test/Coverage/cov_diffuse_interface.tcl — Multi-region diffusion
• Test/Coverage/cov_diffuse_modes.tcl — cov_diffuse_modes.tcl -- Exercise different diffuse modes in DiffControl.cc
• Test/Coverage/cov_diffuse_ramp.tcl — Diffusion with temperature ramp, smooth, and trbdf damping
• Test/Coverage/cov_diffuse_solver_modes.tcl — Test different diffuse solver configurations
• Test/Coverage/cov_diffuse_temperature.tcl — Temperature-dependent diffusion
• Test/Coverage/cov_diffuse_tensor.tcl — Diffusion with tensor (anisotropic) diffusivity
• Test/Coverage/cov_diffuse_wind.tcl — Test diffusion with mesh movement (wind smoothing)
• Test/Coverage/cov_disc_grad_1d.tcl — cov_disc_grad_1d.tcl — 1D Laplace three-way: FE / CV / CVFEM.
• Test/Coverage/cov_disc_grad_2d.tcl — cov_disc_grad_2d.tcl — 2D Laplace three-way: FE / CV / CVFEM.
• Test/Coverage/cov_disc_grad_2d_quad.tcl — cov_disc_grad_2d_quad.tcl — 2D Laplace three-way (FEM/CV/CVFEM)
• Test/Coverage/cov_disc_grad_3d.tcl — cov_disc_grad_3d.tcl — 3D Laplace three-way: FE / CV / CVFEM.
• Test/Coverage/cov_disc_grad_3d_brick.tcl — cov_disc_grad_3d_brick.tcl — 3D Laplace three-way (FEM/CV/CVFEM)
• Test/Coverage/cov_disc_grad_3d_prism.tcl — cov_disc_grad_3d_prism.tcl — 3D Laplace three-way (FEM/CV/CVFEM)
• Test/Coverage/cov_disc_highorder_refuse.tcl — cov_disc_highorder_refuse.tcl — verify disc=cv|cvfem refuses to
• Test/Coverage/cov_disc_iface_2d.tcl — cov_disc_iface_2d.tcl — verify disc=cv|cvfem propagation reaches
• Test/Coverage/cov_disc_mos_charge_1d.tcl — cov_disc_mos_charge_1d.tcl — Phase 6 test 1: MOS charge conservation.
• Test/Coverage/cov_disc_mos_charge_2d.tcl — cov_disc_mos_charge_2d.tcl — 2D MOS Poisson conservation test.
• Test/Coverage/cov_disc_mos_charge_2d_quad.tcl — cov_disc_mos_charge_2d_quad.tcl — 2D MOS Poisson conservation test on
• Test/Coverage/cov_disc_mos_charge_3d.tcl — cov_disc_mos_charge_3d.tcl — 3D MOS Poisson conservation test on a
• Test/Coverage/cov_disc_mos_charge_3d_brick.tcl — cov_disc_mos_charge_3d_brick.tcl — 3D MOS Poisson conservation test on
• Test/Coverage/cov_disc_quadpoint_1d.tcl — cov_disc_quadpoint_1d.tcl — Phase 6 test 2: FE and CVFEM can evaluate K
• Test/Coverage/cov_disc_switch_parse.tcl — cov_disc_switch_parse.tcl — Phase 1 plumbing smoke test.
• Test/Coverage/cov_docgen.tcl — Cov-Docgen — exercise the HTML reference generator
• Test/Coverage/cov_edge_tri_ops.tcl — cov_edge_tri_ops.tcl -- Exercise Edge.cc and Tri.cc geometry paths
• Test/Coverage/cov_eigen_matrix.tcl — Test Eigen sparse matrix paths (EigenCCMatrix, EigenCRMatrix)
• Test/Coverage/cov_eigen_scaled.tcl — Test Eigen matrix paths with scaling enabled (RowScale, ColScale)
• Test/Coverage/cov_elastic_3d.tcl — 3D stress/strain assembly — Elastic.cc Ddim=6 paths
• Test/Coverage/cov_elastic_stress.tcl — Exercise 1D stress path in Elastic.cc
• Test/Coverage/cov_eleboundinfo.tcl — Exercise EleBoundInfo.cc boundary element info paths
• Test/Coverage/cov_element_extended.tcl — Exercise Element.cc extended paths
• Test/Coverage/cov_etch_anisotropic.tcl — Test anisotropic etch operations
• Test/Coverage/cov_etch_velocity_modes.tcl — Etch velocity modes coverage test
• Test/Coverage/cov_expr_conditional.tcl — cov_expr_conditional.tcl -- Exercise RelExpr and IFTExpr paths in Expr.cc
• Test/Coverage/cov_expr_conditional_pde.tcl — Exercise conditional/relational expression paths in PDE assembly context
• Test/Coverage/cov_expr_datafield.tcl — cov_expr_datafield.tcl -- Exercise DataField expression paths in Expr.cc
• Test/Coverage/cov_expr_deriv.tcl — cov_expr_deriv.tcl -- Exercise symbolic derivative paths in Expr.cc
• Test/Coverage/cov_expr_deriv_extended.tcl — Exercise additional Derivative paths in Expr.cc
• Test/Coverage/cov_expr_extended.tcl — Extended expression operator coverage
• Test/Coverage/cov_expr_fermi_quad.tcl — Exercise Fermi-Dirac function paths
• Test/Coverage/cov_expr_fsc_pde_ext.tcl — Exercise fsc/d1fsc/d2fsc in PDE equation context (ForceNodeEval + QuadDerivative)
• Test/Coverage/cov_expr_functions.tcl — Test Alagator expression function derivatives during Newton solve
• Test/Coverage/cov_expr_grad_2d.tcl — cov_expr_grad_2d.tcl -- Exercise GradX/GradY/MagGrad paths in 2D expressions
• Test/Coverage/cov_expr_log10_deriv.tcl — Exercise log10 derivative in Newton context
• Test/Coverage/cov_expr_math_ops.tcl — Expression math operations coverage test
• Test/Coverage/cov_expr_mechanics.tcl — Expression mechanics and select command extended paths
• Test/Coverage/cov_expr_pde_operators.tcl — Extended PDE expression operators for coverage
• Test/Coverage/cov_expr_pde_terms.tcl — cov_expr_pde_terms.tcl -- Exercise additional PDE term types in PartTerm.cc
• Test/Coverage/cov_expr_quad.tcl — cov_expr_quad.tcl -- Exercise QuadEvaluate/QuadDerivative paths in Expr.cc
• Test/Coverage/cov_expr_quad_2d.tcl — cov_expr_quad_2d.tcl -- Exercise QuadEvaluate paths in 2D PDE assembly
• Test/Coverage/cov_expr_quad_extended.tcl — cov_expr_quad_extended.tcl -- Exercise remaining QuadEvaluate/QuadDerivative cases
• Test/Coverage/cov_expr_quad_funcs.tcl — Exercise QuadEvaluate and QuadDerivative paths for functions in PDE equations
• Test/Coverage/cov_expr_quad_misc.tcl — Exercise miscellaneous QuadEvaluate paths: sign, randn, abs, log, exp, sqrt
• Test/Coverage/cov_expr_quad_pow.tcl — Exercise QuadEvaluate/QuadDerivative for pow expressions with data fields
• Test/Coverage/cov_expr_quad_relop.tcl — Exercise QuadEvaluate/QuadDerivative for relational and conditional expressions
• Test/Coverage/cov_expr_quadderiv.tcl — Exercise QuadDerivative paths for mixed data-field + solution expressions
• Test/Coverage/cov_expr_quadeval_trig.tcl — Exercise QuadEvaluate paths for trig functions
• Test/Coverage/cov_expr_reduction.tcl — Expression reduction and complex Alagator expressions
• Test/Coverage/cov_expr_sc_quad.tcl — Exercise superconductor function evaluation paths
• Test/Coverage/cov_expr_sign_fsc.tcl — Exercise uncovered expression paths in Expr.cc FuncExpr::Compute
• Test/Coverage/cov_expr_trig_pde.tcl — Exercise trig function QuadEvaluate and Derivative paths in PDE assembly
• Test/Coverage/cov_face_ops.tcl — cov_face_ops.tcl -- Exercise Face.cc and Volume.cc geometry paths in 3D
• Test/Coverage/cov_fe_step.tcl — Cov-FEStep — smoke test for `fe_step` Tcl command (src/BasePDE/FEStep.cc).
• Test/Coverage/cov_fftmesh.tcl — FFT mesh operations — forward and inverse FFT on 1D mesh
• Test/Coverage/cov_field_data_basic.tcl — Test basic field data operations and field expressions
• Test/Coverage/cov_field_data_boolops.tcl — Test BoolData and multi-type field operations through struct round trips
• Test/Coverage/cov_field_data_ops.tcl — Test Data module operations via C++ test harness
• Test/Coverage/cov_field_data_range.tcl — Test field Range and print.1d paths
• Test/Coverage/cov_field_data_types.tcl — Test field data type operations via struct I/O round trips
• Test/Coverage/cov_field_interface_ops.tcl — Field operations across material interfaces
• Test/Coverage/cov_field_interpolation.tcl — Test field operations with interpolation
• Test/Coverage/cov_field_mesh_extended.tcl — Extended field mesh operations targeting Element.cc, Edge.cc, Tri.cc, Quad.cc
• Test/Coverage/cov_field_operations.tcl — Test field operations and mesh queries
• Test/Coverage/cov_fieldserver_ops.tcl — Exercise FieldServer operations and mesh management paths
• Test/Coverage/cov_fit.tcl — cov_fit.tcl — coverage for src/analysis/fit/fit.cc
• Test/Coverage/cov_fs_units_add.tcl — Cov-FS-Units-Add: units= on fs add overrides the global default. Global
• Test/Coverage/cov_fs_units_clear.tcl — Cov-FS-Units-Clear: `fs clearunits` drops a local override and returns
• Test/Coverage/cov_fs_units_fallback.tcl — Cov-FS-Units-Fallback: fs without -units falls back to the global
• Test/Coverage/cov_fs_units_global.tcl — Cov-FS-Units-Global: baseline. No per-fs units anywhere. The integrate
• Test/Coverage/cov_fs_units_help.tcl — Cov-FS-Units-Help: the new `units` and `clearunits` switches are
• Test/Coverage/cov_fs_units_legacy.tcl — Cov-FS-Units-Legacy: a structure file that was written WITHOUT a
• Test/Coverage/cov_fs_units_multiserver.tcl — Cov-FS-Units-MultiServer: multiple fs's with different local units.
• Test/Coverage/cov_fs_units_save.tcl — Cov-FS-Units-Save: structure write/read round-trip carries the units
• Test/Coverage/cov_fs_units_set.tcl — Cov-FS-Units-Set: `fs units= ...` on a current fs takes effect for
• Test/Coverage/cov_fsc_pde.tcl — Fermi-Dirac integrals in PDE equation context
• Test/Coverage/cov_furnace_rta.tcl — Furnace and RTA anneal coverage test
• Test/Coverage/cov_gan_convergence.tcl — GaN 1D PN diode convergence test.
• Test/Coverage/cov_gan_eqns.tcl
• Test/Coverage/cov_genbc_interface.tcl — Exercise GenericBC interface equation paths in Genbc.cc
• Test/Coverage/cov_geometry_3d_ops.tcl — Test 3D geometry element operations (Tet, Pent, Volume, Face paths)
• Test/Coverage/cov_gmsh_io.tcl — Comprehensive gmsh I/O test — exercises both v2 and v3 readers
• Test/Coverage/cov_gmsh_read.tcl — Confirm both gmsh v2 and v3 ASCII formats load and produce non-zero integrals
• Test/Coverage/cov_grid_shift_coord.tcl — Exercise grid operations and coordinate paths
• Test/Coverage/cov_high_order_1d.tcl — 1D P2 patch test: Laplace on Edge3 mesh
• Test/Coverage/cov_high_order_1d_p3.tcl — 1D P3 cubic patch test: Laplace on EdgeP mesh
• Test/Coverage/cov_high_order_1d_p4.tcl — 1D P4 quartic patch test: Laplace on EdgeP mesh
• Test/Coverage/cov_high_order_quad8.tcl — 2D P2 patch test on quad mesh: Laplace on Quad8 mesh
• Test/Coverage/cov_high_order_tet10.tcl — 3D P2 patch test: Laplace on Tet10 mesh
• Test/Coverage/cov_high_order_tri6.tcl — 2D P2 patch test: Laplace equation on Tri6 mesh
• Test/Coverage/cov_histogram.tcl — cov_histogram.tcl — coverage for src/analysis/stats/histogram.cc
• Test/Coverage/cov_iface_side_2d.tcl — 2D interface side= coupling — IED vs bulk-only on the same diffuse() call.
• Test/Coverage/cov_iface_side_math.tcl — Round-out coverage for the 2D interface side= fix beyond Cov-Iface-Side-2D.
• Test/Coverage/cov_implant_profile.tcl — Implant with profile generation
• Test/Coverage/cov_implant_variance.tcl — Implant profile with dose integration
• Test/Coverage/cov_inherit_chain.tcl — Test the `mater name=X chain` Tcl subcommand and the underlying
• Test/Coverage/cov_inherit_deep_chain.tcl — Behavioral test for chain-aware per-material lookups across the commands
• Test/Coverage/cov_integrate_interface.tcl — Interface mesh integration via Material() in integrate command
• Test/Coverage/cov_interface_bc.tcl — cov_interface_bc.tcl -- Exercise interface boundary condition paths in Genbc.cc
• Test/Coverage/cov_interface_cmd.tcl — Interface finder command test
• Test/Coverage/cov_interface_delta.tcl — Delta function and PDE conservation on a two-region 2D structure.
• Test/Coverage/cov_internal_allmats.tcl — Cov-Internal-Allmats — pin the `allmats` half-space etch path of
• Test/Coverage/cov_internal_deposit_thickness.tcl — Cov-Internal-Deposit-Thickness — pin internal_deposit's `thickness=`
• Test/Coverage/cov_internal_etch.tcl — Test InternalEtch.cc — mesh operations during level-set etching
• Test/Coverage/cov_internal_etch_iso.tcl — Cov-Internal-Etch-Iso — pin internal_etch's `iso thickness=` path:
• Test/Coverage/cov_internal_etch_thickness.tcl — Cov-Internal-Etch-Thickness — pin internal_etch single-material with
• Test/Coverage/cov_internal_iso.tcl — Cov-Internal-Iso — pin the FromSurfaceOffset DistanceField and the
• Test/Coverage/cov_internal_machineetch.tcl — Cov-Internal-MachineEtch — pin internal_machineetch's mask-gated
• Test/Coverage/cov_internal_selmat.tcl — Cov-Internal-Selmat — pin the selmat= filter on internal_deposit's iso
• Test/Coverage/cov_internal_substrate.tcl — Cov-Internal-Substrate — pin the `internal_substrate` TclLib helper that
• Test/Coverage/cov_internal_substrate_masks.tcl — Cov-Internal-Substrate-Masks — pin internal_substrate masks={…} and
• Test/Coverage/cov_internaldep3d.tcl — Cov-InternalDep3D-Voxel — pin the InternalDep3D DistanceField overload
• Test/Coverage/cov_internaletch3d_voxel.tcl — Cov-InternalEtch3D-Voxel — compare the voxel-pipeline retet path
• Test/Coverage/cov_interpolate_cmd.tcl — Interpolate command test
• Test/Coverage/cov_isocontour.tcl — cov_isocontour.tcl -- Exercise MarchingExtract.cc paths
• Test/Coverage/cov_kaschro_basic.tcl — kaschro basic Phase-1 coverage:
• Test/Coverage/cov_kaschro_mirror.tcl — kaschro mirror.kgrid / mirror.mode coverage:
• Test/Coverage/cov_kaschro_prune.tcl — kaschro Phase-5 coverage:
• Test/Coverage/cov_kaschro_ritz.tcl — kaschro Phase-6 coverage:
• Test/Coverage/cov_kaschro_rqi.tcl — kaschro Phase-2 coverage:
• Test/Coverage/cov_kaschro_track.tcl — kaschro Phase-3 coverage:
• Test/Coverage/cov_kcharge.tcl — kcharge coverage:
• Test/Coverage/cov_kcharge_multicomp.tcl — kcharge multi-component coverage:
• Test/Coverage/cov_koverlap.tcl — koverlap coverage:
• Test/Coverage/cov_lbte_2d.tcl — LBTE 2D KSpace coverage:
• Test/Coverage/cov_lbte_kpsi.tcl — LBTE k-dependent ψ retrofit (Phase 6a) coverage:
• Test/Coverage/cov_lbte_lk_overlap.tcl — LBTE on-the-fly overlap — complex multi-spinor coverage.
• Test/Coverage/cov_levelset_aniso_etch.tcl — Test anisotropic etch (exercises EtchLvl.cc direction handling)
• Test/Coverage/cov_levelset_cmp.tcl — Test the CMP etch path through Machine.cc and CMPRate.cc
• Test/Coverage/cov_levelset_conformal.tcl — Test conformal deposition edge cases
• Test/Coverage/cov_levelset_crossconnect.tcl — Test multi-material levelset operations
• Test/Coverage/cov_levelset_curved_etch.tcl — Levelset etch with step geometry for curved surface coverage
• Test/Coverage/cov_levelset_deposit_extended.tcl — Extended deposit test with thin layer
• Test/Coverage/cov_levelset_deposition.tcl — PECVD deposition on step geometry (non-conformal surface)
• Test/Coverage/cov_levelset_distance.tcl — Test the distance measurement command
• Test/Coverage/cov_levelset_eleham.tcl — Test EleHam.cc — LevelSet Hamiltonian for velocity extension
• Test/Coverage/cov_levelset_epi.tcl — Test the epi command argument parsing (epitaxial deposition via level set)
• Test/Coverage/cov_levelset_etch.tcl — Test EtchLvl.cc non-isotropic LevelSet etch path
• Test/Coverage/cov_levelset_etch_3d.tcl — 3D levelset isotropic etch
• Test/Coverage/cov_levelset_etch_meshtype.tcl — Test sequential etch with varying depths (exercises EtchLvl.cc state handling)
• Test/Coverage/cov_levelset_etch_variants.tcl — Levelset etch operations
• Test/Coverage/cov_levelset_grid_refine.tcl — Test LevelSet grid refinement (exercises RectGrid.cc operations)
• Test/Coverage/cov_levelset_init_edge.tcl — Test LevelSet initialization edge cases
• Test/Coverage/cov_levelset_internal_etch.tcl — Test level set etch with internal mesh reconstruction (InternalEtch)
• Test/Coverage/cov_levelset_isotropic_etch.tcl — Isotropic etch on step geometry
• Test/Coverage/cov_levelset_masked_deposit.tcl — Test varied rate deposition (exercises DepLvl.cc rate expression handling)
• Test/Coverage/cov_levelset_material_select.tcl — Levelset operation on selected material
• Test/Coverage/cov_levelset_measurements.tcl — Test AFM, curvature, and thickness measurement commands
• Test/Coverage/cov_levelset_multimaterial.tcl — Test multi-material LevelSet operations
• Test/Coverage/cov_levelset_multistep.tcl — Test multi-step LevelSet operations (deposit, then etch)
• Test/Coverage/cov_levelset_oxidize.tcl — Test the IsMeshingDisabled() early-return path in MeshDeposition
• Test/Coverage/cov_levelset_regrow.tcl — Level set deposit/etch extended coverage test
• Test/Coverage/cov_levelset_sputter.tcl — Sputter deposition on step geometry (non-conformal surface)
• Test/Coverage/cov_levelset_velocity.tcl — cov_levelset_velocity.tcl -- Exercise VelLvl.cc velocity paths
• Test/Coverage/cov_levelset_velocity_ext.tcl — Test VelLvl.cc — velocity level-set calculations
• Test/Coverage/cov_lindhard.tcl — cov_lindhard.tcl — coverage test for src/device/lindhard/lindhard.cc
• Test/Coverage/cov_lk_rotation.tcl — Test that BuildH110 produces the same band structure as BuildH
• Test/Coverage/cov_ls_crossconnect.tcl — Exercise CrossConnect via etch on simple 2D geometry
• Test/Coverage/cov_ls_deposit_modes.tcl — Deposit mode coverage via machine command
• Test/Coverage/cov_ls_epi_growth.tcl — Exercise additional deposit paths
• Test/Coverage/cov_ls_extended_ops.tcl — Extended LevelSet operations targeting VelLvl.cc and LevelSet.cc
• Test/Coverage/cov_ls_levelset_ops.tcl — LevelSet.cc main operations coverage — exercises uncovered paths
• Test/Coverage/cov_ls_machine_ext.tcl — Machine command extended coverage — exercises Machine.cc uncovered paths
• Test/Coverage/cov_ls_sputter_etch.tcl — Sputter deposition coverage — exercises SputterLvl.cc uncovered paths
• Test/Coverage/cov_ls_velocity_modes.tcl — Velocity modes coverage — exercises VelLvl.cc uncovered paths
• Test/Coverage/cov_main_options.tcl — Test main.cc and Options.cc — command-line option parsing and options command
• Test/Coverage/cov_mask_positive.tcl — Mask command: positive mask type, list, clear, multiple rectangles
• Test/Coverage/cov_mater_commands.tcl — Test mater command branches: all, list, add
• Test/Coverage/cov_material_properties.tcl — Material field operations
• Test/Coverage/cov_math_ilu.tcl — Test ILU and Jacobi preconditioners (math/Precond.cc)
• Test/Coverage/cov_math_precond.tcl — Test different iterative solver and preconditioner configurations
• Test/Coverage/cov_math_row_scale.tcl — Test CompRow matrix format and scaling paths (math/matrix.cc, math/Precond.cc)
• Test/Coverage/cov_matrix_transpose.tcl — Exercise matrix TransposeMult via row-based matrix with column scaling
• Test/Coverage/cov_mc_implant.tcl — MC implant coverage test
• Test/Coverage/cov_mc_movie_interval.tcl — `mc movie= ... movie.interval= N` — runs the user's Tcl hook every Nth
• Test/Coverage/cov_mc_tabulated_rates.tcl — `mc scatter.tabulated= ...` — bridge from the shared rate registry
• Test/Coverage/cov_meff_update.tcl — Coverage test for the "schrodinger update" path (UpdateGeneralMeff in
• Test/Coverage/cov_memory_cap.tcl — Exercise the `memory cap=` setter.
• Test/Coverage/cov_memory_cmd.tcl — Exercise the `memory` Tcl command.
• Test/Coverage/cov_mesh_3d_adapt.tcl — Test 3D mesh adaptation and topology operations
• Test/Coverage/cov_mesh_adapt_gradient.tcl — Mesh adaptation based on solution gradient during diffusion
• Test/Coverage/cov_mesh_element_ops.tcl — Mesh element operations
• Test/Coverage/cov_mesh_operations.tcl — cov_mesh_operations.tcl -- Exercise field manipulation and sel paths
• Test/Coverage/cov_mesh_smooth.tcl — Test mesh smoothing and quality reporting on 1D and 2D meshes
• Test/Coverage/cov_mirror_1d.tcl — Cov-Mirror-1D — exercise mirror command on a 1D mesh.
• Test/Coverage/cov_mirror_2d.tcl — Cov-Mirror-2D — exercise mirror on a 2D mesh.
• Test/Coverage/cov_mirror_3d.tcl — Cov-Mirror-3D — exercise mirror on a 3D mesh.
• Test/Coverage/cov_mirror_errors.tcl — Cov-Mirror-Errors — exercise the error paths in mirror_tcl.
• Test/Coverage/cov_mirror_n2.tcl — Cov-Mirror-N2 — exercise the n>1 linear-march branch of mirror.
• Test/Coverage/cov_mosfet_process.tcl — Implant + diffuse + device solve flow (exercises broad code paths)
• Test/Coverage/cov_multicontact_device.tcl — Multi-contact device coverage test
• Test/Coverage/cov_multiregion_pde.tcl — cov_multiregion_pde.tcl -- Multi-region PDE with interface BCs using solution command
• Test/Coverage/cov_newregrid3d.tcl — cov_newregrid3d.tcl — exercise `newregrid3d` + assert volume conservation.
• Test/Coverage/cov_newton_modes.tcl — cov_newton_modes.tcl -- Exercise Newton.cc convergence and damping paths
• Test/Coverage/cov_nodedata_operations.tcl — Node data operations and position-based field
• Test/Coverage/cov_noise_analysis.tcl — Exercise DevControl.cc device store/restore/clear and transient with movie
• Test/Coverage/cov_options_extended.tcl — Exercise additional Options.cc paths
• Test/Coverage/cov_orientation_aniso.tcl — Tcl set_aniso_elastic / set_transverse_iso_elastic coverage.
• Test/Coverage/cov_oxidation_2d.tcl — Level set deposit + etch + diffuse flow (exercises broad cross-module paths)
• Test/Coverage/cov_p2_poisson_gaa_const_ordered_quad8.tcl — P2 Quad8 GAA: workaround ordering. See cov_p2_poisson_gaa_const_ordered_tri6.tcl
• Test/Coverage/cov_p2_poisson_gaa_const_ordered_tri6.tcl — P2 Tri6 GAA: workaround ordering — add interface contact BEFORE flps_grid
• Test/Coverage/cov_p2_poisson_gaa_const_quad8.tcl — P2 Quad8 GAA constant-Dirichlet test. See cov_p2_poisson_gaa_const_tri6.tcl
• Test/Coverage/cov_p2_poisson_gaa_const_tri6.tcl — P2 Tri6 GAA constant-Dirichlet test: regression cover for the
• Test/Coverage/cov_parse_expand.tcl — Parse.cc Expand() and Scan() coverage
• Test/Coverage/cov_pde_2d_assembly.tcl — cov_pde_2d_assembly.tcl -- Exercise 2D PDE assembly paths
• Test/Coverage/cov_pde_3d_assembly.tcl — cov_pde_3d_assembly.tcl -- Exercise 3D PDE assembly paths
• Test/Coverage/cov_pent_brick.tcl — cov_pent_brick.tcl -- Exercise Pent.cc and Brick.cc element paths
• Test/Coverage/cov_plot2d_3d_slicing.tcl — Test plot2d with 3D slicing along x, y, z axes
• Test/Coverage/cov_plot_line_extract.tcl — Field extraction and statistics on 2D mesh
• Test/Coverage/cov_pod_solve.tcl — POD-projected Newton solve coverage test
• Test/Coverage/cov_pointinsert.tcl — Cov-PointInsert — exercise Steiner 1-to-4 point insertion.
• Test/Coverage/cov_poisson_schrodinger.tcl — Minimal Poisson-Schrodinger coupled solver test
• Test/Coverage/cov_profile_extended.tcl — Extended profile command coverage
• Test/Coverage/cov_profile_extract.tcl — Test profile import and layers command
• Test/Coverage/cov_profile_io.tcl — Profile command with file I/O and various options
• Test/Coverage/cov_pull_bandstructure_flat.tcl — Pull-mode BandStructure Flat composer smoke test.
• Test/Coverage/cov_pull_bandstructure_valleys.tcl — Pull-mode BandStructure composer smoke test.
• Test/Coverage/cov_pull_compose_chain.tcl
• Test/Coverage/cov_pull_dielectric.tcl — Dict-driven pull-mode for pure dielectrics.
• Test/Coverage/cov_pull_dispatch.tcl — Phase E POC: dict-based device pull on a 1D Silicon resistor.
• Test/Coverage/cov_pull_generation.tcl — Pull-mode Generation composer smoke test.
• Test/Coverage/cov_pull_kanda.tcl — Phase 3 POC: Silicon Kanda complete parameter set.
• Test/Coverage/cov_pull_mobility.tcl — Phase A POC: dict-based parameter-driven Silicon electron mobility.
• Test/Coverage/cov_pull_mobility_extras.tcl — Constant + Lombardi mobility models — supplements the Phase A
• Test/Coverage/cov_pull_permittivity.tcl — Pull-mode Permittivity composer smoke test.
• Test/Coverage/cov_pull_quantum_dg.tcl — Pull-mode Quantum DG composer smoke test.
• Test/Coverage/cov_pull_recomb_bgn_eg.tcl — Phase C POC: dict-based Recombination / BGN / BandStructure.
• Test/Coverage/cov_pull_render.tcl
• Test/Coverage/cov_pull_stress.tcl — Coverage deck for the pull=<var> dict-based stress dispatcher.
• Test/Coverage/cov_pull_stress_inherit.tcl — Coverage deck for the two layers of stress pull-mode inheritance,
• Test/Coverage/cov_pull_transport.tcl — Transport family — QF / Velocity / SG / Hall / Kanda / DPTensor selector
• Test/Coverage/cov_pull_transport_kanda.tcl — Pull-mode Transport Kanda + DPTensor smoke test.
• Test/Coverage/cov_quad_all_funcs.tcl — Exercise ALL QuadEvaluate/QuadDerivative paths via quad() in PDE
• Test/Coverage/cov_quad_mesh_diffuse.tcl — Test quad (triangular) mesh creation and diffuse
• Test/Coverage/cov_quad_struct.tcl — Test Quad element operations: struct I/O, multi-material, field ops
• Test/Coverage/cov_rate_errors.tcl — Cov-RateErrors — error-path coverage for `rate` Tcl command parser
• Test/Coverage/cov_rate_eval.tcl — `rate eval` — one-shot scalar value of a registered rate at a point on
• Test/Coverage/cov_rate_ff_namedconst.tcl — rate-registry named-ConstTable FF binding consumption coverage:
• Test/Coverage/cov_rate_ff_qspatialotf.tcl — rate-registry QSpatialOTF form-factor binding coverage:
• Test/Coverage/cov_rate_paint.tcl — `rate paint` — substitutes scratch into a registered eqn and paints the
• Test/Coverage/cov_rate_register.tcl — `rate` Tcl command — register / list / dump round-trip coverage.
• Test/Coverage/cov_rate_substitute.tcl — `rate substitute` — word-boundary substitution of walker scratch
• Test/Coverage/cov_rectgrid_contour.tcl — Level set contour and RectGrid operations
• Test/Coverage/cov_refine.tcl — Refinement using the refine command — smoke test across element types
• Test/Coverage/cov_refine_delta.tcl — Delta integration remains correct after refine err=1.
• Test/Coverage/cov_remove_ops.tcl — Test Remove.cc — mesh element removal/collapse operations
• Test/Coverage/cov_ritz_complex.tcl — #####################################################################
• Test/Coverage/cov_ritz_hmode_cplx.tcl — #####################################################################
• Test/Coverage/cov_row_matrix.tcl — Exercise CompRowMatrix::FinishLoad paths
• Test/Coverage/cov_schrodinger_arpack.tcl — ARPACK iterative eigensolver + real update/geteig path coverage
• Test/Coverage/cov_schrodinger_complex.tcl — Complex Hermitian Schrodinger (BdG) path coverage
• Test/Coverage/cov_schrodinger_materials.tcl — Multi-material field operations
• Test/Coverage/cov_segregation_trap.tcl — Segregation and interface trapping coverage test
• Test/Coverage/cov_sel_advanced.tcl — cov_sel_advanced.tcl -- Exercise select expression evaluation paths
• Test/Coverage/cov_sel_cnst_collision.tcl — sel-vs-CNST name collision guard
• Test/Coverage/cov_sel_delete.tcl — sel delete — remove a named data field
• Test/Coverage/cov_sige_alloy.tcl — SiGe alloy equations test at x=0.3 (30% Ge).
• Test/Coverage/cov_sige_eqns.tcl — SiGe multi-valley equations test.
• Test/Coverage/cov_sige_params.tcl — SiGe material parameter endpoint verification.
• Test/Coverage/cov_silicon_hall_currents.tcl — Backfill for Silicon::Eqns Hall / piezo-conductivity tensor.
• Test/Coverage/cov_silicon_strain_polynomials.tcl — Backfill for Silicon::Eqns strain-dependent k.p polynomials.
• Test/Coverage/cov_slice_2d.tcl — 2D structure with gmsh_geo_contour_write covering PlotLine and PlotSeg
• Test/Coverage/cov_solution_commands.tcl — cov_solution_commands.tcl -- Exercise Solution.cc command paths
• Test/Coverage/cov_solution_extended.tcl — Exercise Solution.cc extended paths
• Test/Coverage/cov_solution_management.tcl — Solution management command coverage
• Test/Coverage/cov_solution_ops.tcl — Exercise Solution.cc paths
• Test/Coverage/cov_static_mathfuncs.tcl — Exercise Static.cc math function paths via Newton PDE solving
• Test/Coverage/cov_stats.tcl — cov_stats.tcl — coverage for src/analysis/stats/stats.cc
• Test/Coverage/cov_stress_2d.tcl — Test 2D dimensional vector PDE assembly (stress solver)
• Test/Coverage/cov_stress_eqnmap.tcl — Test stress solver without skipmap (exercises matrix map-building paths)
• Test/Coverage/cov_stress_extended.tcl — Extended 2D stress with anisotropic elastic constants and calcstress
• Test/Coverage/cov_struct_3d_write.tcl — 3D struct write/read coverage for multi-material meshes with contacts
• Test/Coverage/cov_struct_extended.tcl — Extended struct write/read coverage for 2D multi-material meshes
• Test/Coverage/cov_struct_mesh_import.tcl — Test struct reading of Triangle and TetGen mesh formats
• Test/Coverage/cov_struct_mixed.tcl — Exercise Mixed.cc mesh generation using vertex/block/mesh commands
• Test/Coverage/cov_struct_write_extended.tcl — Exercise struct write paths for multiple output formats
• Test/Coverage/cov_struct_write_formats.tcl — Test structure write format variations
• Test/Coverage/cov_superbound_ops.tcl — Test SuperBound.cc and Edge3.cc — super-element boundary operations and 3D edge elements
• Test/Coverage/cov_superconductor_funcs.tcl — Superconductor and Fermi-Dirac integral functions
• Test/Coverage/cov_tasch_implant.tcl — Tasch implant model test
• Test/Coverage/cov_tclmath.tcl — Test Tcl math functions registered in tclMath.c
• Test/Coverage/cov_tdr.tcl — Exercise the `struct tdr=` reader on a sample TDR mesh.
• Test/Coverage/cov_temp_material.tcl — Temperature-dependent material property evaluation test
• Test/Coverage/cov_tensor_aniso.tcl — Exercise Tensor.cc anisotropic line spacing (before/after parameters)
• Test/Coverage/cov_tensorvoxel_mat_maxvol.tcl — Cov-TensorVoxel-Mat-Maxvol — pin tensorvoxel's per-material maxvol
• Test/Coverage/cov_tensorvoxel_mat_mtr.tcl — Cov-TensorVoxel-Mat-Mtr — pin tensorvoxel's per-material mtr path
• Test/Coverage/cov_tensorvoxel_maxvol.tcl — Cov-TensorVoxel-Maxvol — pin tensorvoxel's tetgenopts maxvol path.
• Test/Coverage/cov_tensorvoxel_pointcloud.tcl — Cov-TensorVoxel-PointCloud — exercise tensorvoxel's PointCloud auto-trigger.
• Test/Coverage/cov_test_adapt.tcl — Test adapt command exercising mesh adaptation internals
• Test/Coverage/cov_test_data.tcl — Test the standalone test_data C++ test harness
• Test/Coverage/cov_test_distance.tcl — Test the standalone test_distance C++ test harness
• Test/Coverage/cov_test_element.tcl — cov_test_element.tcl -- Exercise Element/Tri/Quad/Node geometry paths via test harness
• Test/Coverage/cov_test_element_1d.tcl — cov_test_element_1d.tcl -- Exercise Element paths in 1D
• Test/Coverage/cov_test_face.tcl — cov_test_face.tcl -- Exercise Face/Edge/Volume/Tet geometry paths
• Test/Coverage/cov_test_face_3d.tcl — cov_test_face_3d.tcl -- Exercise Face/Edge/Volume/Tet geometry in 3D
• Test/Coverage/cov_test_mesh.tcl — cov_test_mesh.tcl -- Exercise Mesh geometry paths
• Test/Coverage/cov_test_utils_3d.tcl — Test the standalone test_utils_3d C++ test harness
• Test/Coverage/cov_tif.tcl — Exercise the `struct tif=` reader on a sample TIF mesh.
• Test/Coverage/cov_time_3d_init.tcl — 3D init timing benchmark — ~58x58x60 = ~200k nodes
• Test/Coverage/cov_time_3d_read.tcl — 3D read benchmark — generate ~200k node mesh, save as .str, then re-read it
• Test/Coverage/cov_traps.tcl — Minimal interface trap test
• Test/Coverage/cov_tspline.tcl — tspline N-D tensor spline lookup table.
• Test/Coverage/cov_tspline_slice.tcl — cov_tspline_slice.tcl — `tspline slice` projects an N-axis table onto
• Test/Coverage/cov_userparam_types.tcl — Exercise UserParam help and parsing paths
• Test/Coverage/cov_utils_3d.tcl — Test 3D geometry utilities via C++ test harness
• Test/Coverage/cov_validateunits.tcl — Exercise the validateunits / defineunit Tcl commands.
• Test/Coverage/cov_values_ops.tcl — Exercise Values.cc and Derivs paths via PDE expressions with relational ops
• Test/Coverage/cov_vertex.tcl — Tests vertex command
• Test/Coverage/cov_vertex_block.tcl — Vertex construction and dump
• Test/Coverage/cov_voronoi_2d.tcl — Exercise Voronoi2D.cc — Delaunay edge swapping
• Test/Coverage/cov_voxel_dump.tcl — Cov-VoxelDump — exercise `dumpvoxelgmsh` (src/field/voxel/voxel_dump.cc).
• Test/Coverage/diffuse_2d.tcl — 2D spatial diffusion test
• Test/Coverage/diffuse_basic.tcl — Basic diffusion test - Gaussian spreading
• Test/Coverage/expr_advanced.tcl — Test Alagator expressions: multi-solution PDE assembly and post-processing
• Test/Coverage/implant_basic.tcl — Basic ion implantation test
• Test/Coverage/implant_dual.tcl — Dual Pearson implant distribution for Boron in silicon
• Test/Coverage/mater_ops.tcl — Test material database operations
• Test/Coverage/matrix_gmres.tcl — Test GMRES iterative solver paths
• Test/Coverage/matrix_ops.tcl — Test matrix solver paths not covered by existing matrix tests
• Test/Coverage/mesh_adapt.tcl — Test 2D mesh operations and data fields
• Test/Coverage/mesh_regrid.tcl — Test mesh adaptation via flps_grid regrid and smooth commands
• Test/Coverage/multiregion_diffuse.tcl — Two-region diffusion with flux continuity at interface
• Test/Coverage/nodedata_2d.tcl — Test node data operations in 2D mesh
• Test/Coverage/oned_levelset.tcl — 1D LevelSet Deposit and Etch
• Test/Coverage/pn_diode_sg.tcl — 1D PN diode with Scharfetter-Gummel
• Test/Coverage/poisson_1d.tcl — 1D Poisson equation with known analytic solution
• Test/Coverage/profile_cmd.tcl — Test the profile command for reading SIMS-like data
• Test/Coverage/sel_ops.tcl — Test sel expression operations and math functions
• Test/Coverage/struct_formats.tcl — Test all structure command output formats
• Test/Coverage/struct_io.tcl — Test structure file write and read-back
• Test/Coverage/updatecoords.tcl — Apply a z-displacement field via `updatecoordinates disp=` on a 2D Oxide/Silicon
• Test/Coverage/updatecoords_abs.tcl — Verify the "coordinates=" variant of updatecoordinates: pass an absolute
• Test/Coverage/vel_grad_pde.tcl — Test VelX/VelY/VelZ discrete velocity functions with GradX/GradY/GradZ arguments

MCP (7)

• Test/MCP/agent_dsl.tcl — agent_dsl — direct coverage of the `agent` Tcl DSL.
• Test/MCP/mcp_http.tcl — mcp_http — integration test for the real HTTP MCP path.
• Test/MCP/mcp_inject.tcl — mcp_inject — load-bearing security regression for the MCP arg-binding
• Test/MCP/mcp_session_attach.tcl — mcp_session_attach — multi-session persistence + reattach with
• Test/MCP/mcp_session_busy.tcl — mcp_session_busy — attach to a session whose meta.json carries a
• Test/MCP/mcp_smoke.tcl — mcp_smoke — MCP server activation + synchronous dispatch round-trip.
• Test/MCP/mcp_tools_list.tcl — mcp_tools_list — verify the inspect-agent's tool surface registers

TclLib (19)

• Test/TclLib/tcllib_ddpackage_smoke.tcl — Coverage deck for TclLib/Models/BandstructurePackage.tcl.
• Test/TclLib/tcllib_elastic_inherit.tcl — Coverage deck for chain-aware elastic constant resolution.
• Test/TclLib/tcllib_germanium_models.tcl — Coverage deck for missed Germanium procs.
• Test/TclLib/tcllib_hook_inherit.tcl — Verify that matparam_proc chain-walks across the inherit chain so a
• Test/TclLib/tcllib_iii_v_models.tcl — Coverage deck for III-V (GaN / AlGaN / AlN) generic-accessor pulls.
• Test/TclLib/tcllib_interpolate.tcl — Coverage deck for TclLib/Device/Utilities/Interpolate/.
• Test/TclLib/tcllib_matparam.tcl — Coverage deck for TclLib/Models/Matparam.tcl. Verifies chain-walking
• Test/TclLib/tcllib_matparam3.tcl — Coverage deck for matparam_sub3 (4-deep chain-walking parameter lookup).
• Test/TclLib/tcllib_matparam_proc.tcl — Coverage deck for matparam_proc — the chain-walking proc resolver in
• Test/TclLib/tcllib_pde_accum.tcl — Coverage deck for TclLib/Models/PdeAccumulator.tcl.
• Test/TclLib/tcllib_pull_dispatch.tcl — Coverage deck for TclLib/Models/Combinators.tcl — the three pull-mode
• Test/TclLib/tcllib_sic_models.tcl — Coverage deck for the SiC family device equations.
• Test/TclLib/tcllib_sige_models.tcl — Coverage deck for missed SiGe procs.
• Test/TclLib/tcllib_silicon_models.tcl — Coverage deck for missed Silicon procs.
• Test/TclLib/tcllib_species_decl.tcl — Coverage deck for TclLib/Models/SpeciesDecl.tcl.
• Test/TclLib/tcllib_species_defect.tcl — Coverage deck for TclLib/Models/SpeciesDecl.tcl::species_defect. Mirrors
• Test/TclLib/tcllib_strain_helpers.tcl — Coverage deck for TclLib/Device/Utilities/Strain/ helpers.
• Test/TclLib/tcllib_stub_elastic.tcl — Coverage deck for the stub-material elasticity providers.
• Test/TclLib/tcllib_tensor_math.tcl — Coverage deck for TclLib/Device/Utilities/Tensor/.

alagator (1)

• Test/alagator/Functions.tcl — Sweeps the Alagator built-in function set (log/exp/trig/erf/sqrt/grad/Fermi/fsc) by integrating each over a 1D Silicon slab and checking the summed result.

device (62)

• Test/device/contact-spec/POD_sweep.tcl — Ramp a 1D resistor contact from 0 to 5V twice (FEQF POD reduced-order vs full
• Test/device/contact-spec/contact_specifications.tcl — 1D diode at 0.05V using Boltzmann (DevPsi/Qfn/Qfp) drift-diffusion, then re-runs the
• Test/device/contact-spec/inherit.tcl — Sweep a 1D pn diode IV with two structures: a single-Silicon-region "OldTest" and
• Test/device/densitygradient/1ddg.tcl — 1D MOS capacitor (oxide on n-Si) ramped to -10V on the gate with FEQF density-gradient
• Test/device/densitygradient/1ddg_scat.tcl — 1D electron-only FEQF resistor with optional point-source scattering, swept twice:
• Test/device/densitygradient/1ddg_scat_hole.tcl — 1D hole-only FEQF resistor with optional point-source scattering, swept twice:
• Test/device/densitygradient/2D.tcl — 2D n-type MOS cap (oxide/silicon) at Vg=+4V, sweeping density-gradient gamma
• Test/device/densitygradient/2DHole.tcl — 2D p-type MOS cap (oxide/silicon) at Vg=-4V, comparing classical Fermi-Dirac hole
• Test/device/densitygradient/dg2.tcl — 1D MOS cap iterated with DGEquation-driven Lambda updates followed by a
• Test/device/densitygradient/dg_simp.tcl — 1D MOS cap (Fermi-Dirac F12 electron statistics) at Vg=+4V, sweeping
• Test/device/densitygradient/dg_simp_boltz.tcl — 1D MOS cap (Boltzmann Nc*exp electron statistics) at Vg=+4V, sweeping
• Test/device/generation/ZenerTest.tcl — Loads a 1D refined structure and ramps an emitter contact past Zener breakdown
• Test/device/hemt/hemt_floods.tcl — AlGaN/GaN HEMT using floods equation procs
• Test/device/mos/ACTest.tcl — 2D MOSFET ramped from Vg=-3 to +3V, comparing the DC gate capacitance (finite-difference
• Test/device/mos/mosfet.tcl — 2D NMOS with explicit DevPsi/Elec/Hole Scharfetter-Gummel drift-diffusion (sgrad),
• Test/device/nopdb/poisson.tcl — Solve a 1D Poisson-like PDE on a Silicon bar with fixed contacts at both ends, exercising the post-pdb-removal solution+contact stack.
• Test/device/picard/picard-single.tcl — Single-process Picard iteration: decompose into N subdomains, sweep them serially in one interpreter, and time vs. the monolithic device solve.
• Test/device/picard/picard_master.tcl — Driver for Picard domain-decomposition: split a 3D Silicon cube into N subdomains, dispatch picard_slave.tcl per piece, recombine, and iterate to convergence against the analytic answer.
• Test/device/picard/picard_slave.tcl — Helper: worker invoked by picard_master.tcl for subdomain $argv[0]; loads the partitioned struct, solves the local Foo PDE, writes picard.<n>.str.
• Test/device/pod/densesolve.tcl — Exercise the `densesolve` Tcl command (LAPACK dgesv wrapper) on 2x2 identity, 2x2 general, and 3x3 systems with hand-computed answers.
• Test/device/pod/spline.tcl — Exercise the `spline` Tcl command: error paths for malformed xlist/ylist/val arguments, then sweep linear and cubic interpolation against a 1D field for several quadratic-curve test cases.
• Test/device/quantum/PoissonSchrodinger/1d-elec.tcl — Self-consistent 1D Poisson-Schrodinger MOS-cap solve for electrons at Vg=1.0V, checking the inversion-layer sheet density against a gold value.
• Test/device/quantum/PoissonSchrodinger/1d-hole.tcl — Self-consistent 1D Poisson-Schrodinger MOS-cap solve for holes at Vg=-0.3V using the k.p Schrodinger100SolveKP path, checking the accumulation-layer sheet density against a gold value.
• Test/device/quantum/PoissonSchrodinger/kp_test.tcl — 1D delta-doped Si MOS-cap Poisson-Schrodinger test with optional double delta layer, exercising the k.p Schrodinger path through multi-region SiliconSub/SiliconDouble inheritance.
• Test/device/quantum/Tunnel/kp_test.tcl — 1D delta-doped Si MOS-cap k.p tunneling variant (Tunnel/): no SchrodingerMask, exercises the tunnel solve path on top of Poisson-Schrodinger.
• Test/device/quantum/Tunnel/sweep-ge-paper.tcl — Germanium MOS-cap tunneling reproduction: top/bottom gate sweep on Ge between two oxides with k.p band parameters, replicating the Ge paper figure.
• Test/device/quantum/Tunnel/sweep_test.tcl — 1D delta-doped Si MOS-cap with tunneling: stripped/sped-up cousin of sweep-ge-paper.tcl, drives Poisson-Schrodinger plus the tunnel solve over a small gate bias sweep.
• Test/device/resistor/1dgrid.tcl — Helper: builds a 1D Silicon bar (0 to 1 um, 0.1 spacing) with VSS/GND ohmic contacts. Sourced by pn.tcl, pn_advection.tcl, qf.tcl, sg.tcl, etc.
• Test/device/resistor/4hsic.tcl — 1D 4H-SiC NP resistor: ramp VSS to 1V and check FEQF ohmic current against gold, exercising the 4HSiC material model end-to-end.
• Test/device/resistor/PNdiode.tcl — 1D PN diode forward sweep on the legacy DevicePackage stack (DevPsi/Elec/Hole alagator equations), not the FEQF wrapper.
• Test/device/resistor/ThrowTest.tcl — 2D MOSFET deck that intentionally drives the device solve into divergence and asserts that the failure surfaces as a Tcl-catchable error (not a panic).
• Test/device/resistor/cache_bug.tcl — Regression for the ExprStore cache bug where `sel z= 0 name= DevPsi` followed by `sel z= Elec` would read a stale cached value instead of recomputing from the FEQF expression.
• Test/device/resistor/pn.tcl — 1D PN diode FEQF ramp with on-the-fly plotting of Eval and Qfp during the contact sweep, smoke-testing the FEQF + plot interaction.
• Test/device/resistor/pn_advection.tcl — 1D PN-junction advection diagnostic: solve FEQF on a step-doped diode and decompose the contact current into drift, diffusion, and gradient components via alagator expressions.
• Test/device/resistor/qf.tcl — 1D PN resistor with FEQF + legacy Silicon equations: ramp VSS to 1V, check ohmic current to 1% against gold.
• Test/device/resistor/qf_high.tcl — 1D PN diode under high doping (1e20 both sides) on a 100 nm scale, stressing the FEQF quasi-Fermi solver near degeneracy.
• Test/device/resistor/resist.tcl — 1D Silicon resistor on the legacy DevicePackage stack: declares DevPsi/Elec/Hole solutions explicitly (no FEQF wrapper) and ramps the VSS contact.
• Test/device/resistor/sg.tcl — 1D Silicon resistor on the Scharfetter-Gummel device stack: p-type and n-type symmetric checks against gold ohmic current to validate the legacy SG path against FEQF.
• Test/device/segregation/Seg2.tcl — Si/Oxide impurity segregation across an interface with explicit alagator side equations, verifying mass conservation via FindDose2D dose integrals.
• Test/device/segregation/Segregation.tcl — 1D Gaussian impurity diffusing in silicon between two oxide caps, exercising the diffuse solver and layers/integrate dose accounting.
• Test/device/strain/PiezoHall/factor.tcl — 2D piezo-Hall test on a 30x30 um square: legacy mobility equations with __Hall flag at T=Temp and T=300, comparing the hall factor before/after switching.
• Test/device/strain/PiezoHall/partial.tcl — 2D piezo-Hall test on a 30x30 um square: current device pull=[::Defaults::device] (non-legacy) path with __Hall flag, complementing factor.tcl's legacy comparison.
• Test/device/strain/PiezoHall/square.tcl — Helper: builds the 30x30x1 um Silicon square mesh used by the PiezoHall test decks (factor.tcl, partial.tcl).
• Test/device/strain/PiezoResistance/electrons/current.tcl — 2D Si n-resistor piezo-DP electron mobility baseline: ramp VSS to 0.2V on legacy equations, capture the bias current as the unstrained reference.
• Test/device/strain/PiezoResistance/electrons/nDP.tcl — 2D Si n-resistor piezo-DP electron mobility check: ramp to 0.5V, then sweep uniaxial stress (Si::UniformStress) and verify the current shift matches the deformation-potential model.
• Test/device/strain/PiezoResistance/electrons/nKanda.tcl — 2D Si n-resistor piezo-Kanda electron mobility check: ramp to 0.5V with Silicon::Kanda at (001)<100> and verify the Kanda piezo-coefficient prediction.
• Test/device/strain/PiezoResistance/electrons/optimize/nDPbrute.tcl — SLURM-driven brute-force grid search over Si electron deformation-potential parameters (Xid, Xiu, f) by repeatedly invoking nDPerror.tcl and tabulating the error.
• Test/device/strain/PiezoResistance/electrons/optimize/nDPerror.tcl — Error functional for the electron-DP optimizer: takes a parameter list on $argv, drives the 2D Si n-resistor at 0.5V, and emits the current as the optimizer's objective.
• Test/device/strain/PiezoResistance/electrons/optimize/nDPoptimize.tcl — SLURM-driven optimizer for Si electron deformation-potential parameters: applies range penalties and shells out to nDPerror.tcl per evaluation.
• Test/device/strain/PiezoResistance/electrons/optimize/pDPerror.tcl — Misplaced hole-DP error variant kept under electrons/optimize: drives the 2D n-resistor at 0.5V for the hole-DP optimizer's objective; logical sibling lives under holes/optimize/.
• Test/device/strain/PiezoResistance/holes/current.tcl — 2D Si p-resistor piezo-DP hole mobility baseline: ramp VSS to 0.2V on legacy hole equations, capture the bias current as the unstrained reference.
• Test/device/strain/PiezoResistance/holes/optimize/pDPerror.tcl — Error functional for the hole-DP optimizer: takes a k.p strain parameter list on $argv, applies uniform stress, drives the 2D Si p-resistor at the bias point, and emits the current.
• Test/device/strain/PiezoResistance/holes/optimize/pDPoptimize.tcl — SLURM-driven optimizer for Si hole deformation-potential / k.p parameters: applies range penalties and shells out to pDPerror.tcl per evaluation.
• Test/device/strain/PiezoResistance/holes/pDP.tcl — 2D Si p-resistor piezo-DP vs piezo-Kanda hole-mobility cross-check: stress-sweep the resistor and compare DP-extracted piezo-coefficients to Kanda model values.
• Test/device/strain/PiezoResistance/holes/pDP2.tcl — 2D Si p-resistor piezo-DP hole mobility check (variant 2, no EqnsLegacy seed): ramp to 0.5V, sweep stress, compare current shift to deformation-potential model.
• Test/device/strain/PiezoResistance/holes/pKanda.tcl — 2D Si p-resistor piezo-Kanda hole mobility check at (001)<100>: ramp to 0.5V with zero-stress KandaEqns and verify the unstrained-current baseline matches the Kanda model.
• Test/device/strain/grid_2D.tcl — Helper: builds the 2D Silicon square (1x1 um, quad mesh) with X- or Y-direction contacts used by the PiezoResistance electrons/holes test decks.
• Test/device/strain/grid_3D.tcl — Helper: builds a 3D Silicon cube (1x1x1 um, tet/brick mesh) with selectable contact orientation, sourced by 3D strain test decks.
• Test/device/traps/InterfaceTraps-Edge.tcl — NMOS/PMOS gate-bias sweep of a band-edge interface trap distribution: $argv selects polarity and trap type (donor/acceptor), then ramps gate and records the C-V shift to a .dat file.
• Test/device/traps/InterfaceTraps-Mid.tcl — NMOS/PMOS gate-bias sweep of a mid-gap interface trap distribution: $argv selects polarity and trap type (donor/acceptor), then ramps gate and records the C-V shift to a .dat file.
• Test/device/traps/RunTraps.tcl — Driver: shells out to InterfaceTraps-Edge.tcl and InterfaceTraps-Mid.tcl for all four NMOS/PMOS x acceptor/donor combinations, then sums the resulting .dat files into a pass/fail check.
• Test/device/traps/support.tcl — Helper: defines MosGrid/NMosGrid/PMosGrid mesh+contact procs and the RampPlot C-V sweep proc, sourced by InterfaceTraps-Edge.tcl and InterfaceTraps-Mid.tcl.

fft (1)

• Test/fft/fft_test.tcl — Forward + inverse fftmesh round-trip on a 1D field; verifies the recovered integral matches the original.

mc (3)

• Test/mc/mc_1d.tcl — 1D MC test: all three phases
• Test/mc/mc_2d.tcl — 2D MC test: all three phases
• Test/mc/mc_3d.tcl — 3D MC test: all three phases

mirror (1)

• Test/mirror/mirror_2d_multi_region.tcl — mirror_2d_multi_region — 2D oxide-on-silicon stack mirrored about Right.

misc (1)

• Test/parallel.tcl

process (41)

• Test/process/diffuse/DiffComp.tcl — Compare linear diffusion of a Gaussian As profile across 1D, 2D (tri and quad), and 3D (tet and brick) meshes to verify junction depth agreement and time the mesh variants.
• Test/process/diffuse/DiffNonLin.tcl — Drive nonlinear concentration-dependent diffusion of a Gaussian dopant in 1D via an Alagator PDE with a Test/1e19 prefactor and watch the profile evolve under diffuse.
• Test/process/diffuse/Seg1v2.tcl — Exercise oxide/silicon interface segregation of a diffusing impurity in 1D and 2D (cylindrical and planar), checking dose conservation across the segregation boundary via integrated layer doses.
• Test/process/diffuse/SurfRecomb.tcl — Transient interstitial-diffusion test under an RTA ramp: seed implant damage (Inter), advance with an Arrhenius-temperature-dependent grad(Inter/CIStar) PDE, and apply a kink-site surface recombination BC at the oxide/silicon interface, checking final temperature and surface concentration against gold.
• Test/process/diffuse/Trap.tcl — Drive 1D oxide/silicon Imp diffusion with an interface trap-saturation PDE term (1e14-Imp)*Imp(Silicon) plus an oxide-side surface loss, sampling trapped-charge evolution at the interface and gating on the integrated final dose.
• Test/process/implant/FindDose.tcl — Helper: FindDose1D and FindDose2D procs that sum positive Silicon-layer doses reported by the `layers` command in 1D and along a y-cut in 2D, used by the Halo* implant decks.
• Test/process/implant/Halo2D.tcl — Implant 65 keV arsenic at tilts 0/15/30/45/60 degrees through a 2D nitride-spacer/poly-gate/oxide/silicon halo structure and check the summed dose across all five tilts against a gold value.
• Test/process/implant/HaloDim.tcl — Cross-check 2D tilted/rotated arsenic implants against an equivalent 1D implant — implant at tilt=30 with rot=0/90/180/270 in a 2D oxide/silicon stack, then repeat in a 1D stack, and compare integrated Silicon doses to gold values.
• Test/process/implant/HaloRot.tcl — Implant 65 keV arsenic at fixed 30-degree tilt with rotations of 0/90/180/270 degrees through a 2D nitride-spacer/poly-gate/oxide/silicon halo structure and verify the per-rotation integrated Silicon dose against gold values.
• Test/process/implant/Tilt1D.tcl — Implant 65 keV arsenic at tilts 0/15/30/45/60 degrees through a 1D oxide/silicon stack and verify the per-tilt integrated Silicon dose against gold values (validates the 1D tilt projection).
• Test/process/lattice/lattice.tcl — Lattice command: generate 2D/3D crystalline node layouts for Silicon (default, fcc, bcc, diamond) and compare against gold structures.
• Test/process/levelset/3D/dep_internal.tcl — #########################################################################
• Test/process/levelset/3D/etch_aniso.tcl — #########################################################################
• Test/process/levelset/3D/etch_iso_3D.tcl — 3D isotropic etch of an Oxide layer through a HardMask slit, verifying remaining-volume integral against a gold value.
• Test/process/levelset/3D/etch_multi.tcl — #########################################################################
• Test/process/levelset/3D/etch_tmp.tcl — 3D anisotropic + isotropic etch of an Oxide layer through two rectangular negative masks (metal trench + circular via cutout), against a gold structure.
• Test/process/levelset/3D/etch_try.tcl — 3D isotropic etch of an Oxide region through a negative mask slit; writes a gmsh debug mesh (no PASS/FAIL gate — exploratory deck).
• Test/process/levelset/3D/etch_via.tcl — 3D isotropic etch of an Oxide trench through a negative mask, verifying remaining-volume integral against a gold value.
• Test/process/levelset/3D/etch_via_law.tcl — 3D isotropic etch of an Oxide via under a HardMask, comparing the resulting structure to a gold .str file.
• Test/process/levelset/3D/refine3d.tcl — 3D mesh-adapt refine on a gas/Oxide layout (no level-set motion), comparing the refined structure against a gold .str file.
• Test/process/levelset/3D/wire.tcl — 3D unmasked Silicon etch driven by an Alagator field expression (MoleFractionRate) wired into an alagator machine — exercises spatially varying rate without masks.
• Test/process/levelset/aniso_ang.tcl — #########################################################################
• Test/process/levelset/backend.tcl — #########################################################################
• Test/process/levelset/cavity.tcl — #########################################################################
• Test/process/levelset/dep_grid.tcl — #########################################################################
• Test/process/levelset/etch_2mask.tcl — #########################################################################
• Test/process/levelset/etch_2mask_interpolate.tcl — #########################################################################
• Test/process/levelset/etch_aniso.tcl — #########################################################################
• Test/process/levelset/etch_aniso_internal.tcl — #########################################################################
• Test/process/levelset/etch_aniso_machine.tcl — #########################################################################
• Test/process/levelset/etch_aniso_oxide.tcl — #########################################################################
• Test/process/levelset/etch_cmp.tcl — #########################################################################
• Test/process/levelset/etch_iso.tcl — #########################################################################
• Test/process/levelset/fullflow_anod.tcl — #########################################################################
• Test/process/levelset/fullflow_demo_seed.tcl — #########################################################################
• Test/process/levelset/masknegpos.tcl — #########################################################################
• Test/process/levelset/plasma.tcl — Plasma etch of an Oxide via with ion-flux + reflection parameters (sp1, ref, volt, ion) through a negative mask, comparing remaining-material integral to a gold.
• Test/process/levelset/spacer.tcl — Spacer-formation flow on Silicon: deposit oxide + poly, masked aniso poly etch to form gate stacks, conformal oxide deposit, then unmasked aniso oxide etch to leave sidewall spacers.
• Test/process/levelset/sputter1.tcl — #########################################################################
• Test/process/levelset/update_gold.tcl — Helper: regenerates levelset gold .str fixtures by re-running each test deck via $FLOOXS with the update flag; not a test itself.
• Test/process/misc/profile.tcl — ##################################################

schrodinger (37)

• Test/schrodinger/aschro/1DKane.tcl — #####################################################################
• Test/schrodinger/aschro/LK.tcl — #####################################################################
• Test/schrodinger/aschro/RayleighProfileReal.tcl — #####################################################################
• Test/schrodinger/aschro/RayleighTestLarge.tcl — #####################################################################
• Test/schrodinger/aschro/aschro-real.tcl — 1D Si quantum well, real effective-mass Schrödinger solve through the
• Test/schrodinger/aschro/aschro.tcl — 1D Si quantum well, real-mode aschro with strain-aware Silicon parameters,
• Test/schrodinger/aschro/bdg.tcl — Coarse FEA BdG self-consistent solver for an SIS-like Nb/barrier/Nb stack,
• Test/schrodinger/aschro/overlap.tcl — #####################################################################
• Test/schrodinger/aschro/ritz-lk-hmode.tcl — #####################################################################
• Test/schrodinger/aschro/ritz-lk.tcl — 6-band Luttinger-Kohn Hamiltonian: full aschro eigensolve produces a basis,
• Test/schrodinger/aschro/ritz.tcl — Rayleigh-Ritz projection for 1D effective-mass Schrödinger: builds an
• Test/schrodinger/bdg/SFS.tcl — Superconductor / Ferromagnet / Superconductor Josephson junction via the
• Test/schrodinger/bdg/SFS_bdgaschro.tcl — Superconductor / Ferromagnet / Superconductor Josephson junction via the
• Test/schrodinger/bdg/SIS.tcl — Superconductor / Insulator / Superconductor Josephson junction via the
• Test/schrodinger/bdg/SIS_bdgaschro.tcl — Superconductor / Insulator / Superconductor Josephson junction via the
• Test/schrodinger/bdg/SNS.tcl — Superconductor / Normal-metal / Superconductor Josephson junction via the
• Test/schrodinger/bdg/SNS_bdgaschro.tcl — Superconductor / Normal-metal / Superconductor Josephson junction via the
• Test/schrodinger/bdg/SimpleBdGGrid.tcl — Helper: defines SimpleBdGGrid, a parametrized Nb / barrier-material / Nb
• Test/schrodinger/bdg/sim.tcl — Inline SIS Nb/Oxide/Nb mesh setup (predates SimpleBdGGrid factoring) that
• Test/schrodinger/tb/cov_tb_lattice.tcl — #####################################################################
• Test/schrodinger/tb/cov_tight_binding.tcl — Minimal tight-binding band structure test — Si, Gamma point only
• Test/schrodinger/tb/params.tcl — Helper: Jancu 1998 sp3d5s* tight-binding parameter sets (PRB 57, 6493)
• Test/schrodinger/tb/slater.tcl — Helper: Slater-Koster two-center integral procs (s-s, s-p, p-p, s-d, p-d,
• Test/schrodinger/tb/spds-general.tcl — Helper: builds the sp3d5s* tight-binding Hamiltonian (Jancu et al., PRB 57,
• Test/schrodinger/tb/spds-test.tcl — Profile-labeled sp3d5s* tight-binding gold-value sweep across C, Si, Ge,
• Test/schrodinger/tb/tb_params.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_bdg.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_heterostructure.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_lattice_mesh.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_neighbors.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_nosoc.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_silicon.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_slater_koster.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_strain.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_unfold.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_unfold_supercell.tcl — #####################################################################
• Test/schrodinger/tb/test_tb_unfold_sweep.tcl — #####################################################################

spice (28)

• Test/spice/spice_bjt_ce.tcl — spice_bjt_ce.tcl -- BJT common-emitter operating point.
• Test/spice/spice_bjt_gp_ce.tcl — spice_bjt_gp_ce.tcl -- Gummel-Poon LEVEL=2 high-injection rolloff.
• Test/spice/spice_cmos_mixed_picard.tcl — spice_cmos_mixed_picard.tcl -- v13 Test A: mixed CMOS via Picard.
• Test/spice/spice_diode_dc_sweep.tcl — spice_diode_dc_sweep.tcl -- diode IV via .dc, validated against ngspice-46.
• Test/spice/spice_diode_op.tcl — spice_diode_op.tcl -- exponential diode forward bias.
• Test/spice/spice_error_lineno.tcl — spice_error_lineno.tcl -- verify the translator error format carries
• Test/spice/spice_inverter_tcad.tcl — spice_inverter_tcad.tcl -- TCAD-MOSFET inverter capstone.
• Test/spice/spice_jfet_ps_sat.tcl — spice_jfet_ps_sat.tcl -- JFET Parker-Skellern Level 2 short-channel effect.
• Test/spice/spice_jfet_sat.tcl — spice_jfet_sat.tcl -- JFET in saturation. Analytical Id = Beta*Vgst^2 = 1mA,
• Test/spice/spice_lc_tank.tcl — spice_lc_tank.tcl -- LC tank at resonance, headline test for v3's
• Test/spice/spice_mosfet_l1_sat.tcl — spice_mosfet_l1_sat.tcl -- MOSFET LEVEL=1 in saturation.
• Test/spice/spice_mosfet_l2_subth.tcl — spice_mosfet_l2_subth.tcl -- LEVEL=2 subthreshold conduction.
• Test/spice/spice_mosfet_l3_dibl.tcl — spice_mosfet_l3_dibl.tcl -- LEVEL=3 DIBL distinguishing test.
• Test/spice/spice_mutual_xfmr.tcl — spice_mutual_xfmr.tcl -- transformer with K mutual inductance.
• Test/spice/spice_picard_transient.tcl — spice_picard_transient.tcl -- v12 Picard transient smoke test.
• Test/spice/spice_pulse_periodic.tcl — spice_pulse_periodic.tcl -- verify PULSE actually repeats.
• Test/spice/spice_pulse_rc.tcl — spice_pulse_rc.tcl -- SPICE PULSE source driving an RC, transient via .tran.
• Test/spice/spice_rc_op.tcl — spice_rc_op.tcl -- SPICE translator vs ngspice on a linear resistor divider.
• Test/spice/spice_rc_tran.tcl — spice_rc_tran.tcl -- RC step transient through SPICE translator.
• Test/spice/spice_ring_oscillator.tcl — spice_ring_oscillator.tcl -- Nightly-tier scale test combining
• Test/spice/spice_subckt_simple.tcl — spice_subckt_simple.tcl -- two-instance subcircuit expansion + isolation.
• Test/spice/spice_suffixes.tcl — spice_suffixes.tcl -- exercise comments, suffixes, and continuation.
• Test/spice/spice_switch_rc.tcl — spice_switch_rc.tcl -- voltage-controlled switch driving an RC.
• Test/spice/spice_tcad_bridge.tcl — spice_tcad_bridge.tcl -- validate the level=tcad dispatcher contract.
• Test/spice/spice_tcad_current_drive.tcl — spice_tcad_current_drive.tcl -- SPICE deck drives a NETWORK-mode TCAD
• Test/spice/spice_translate_dryrun.tcl — spice_translate_dryrun.tcl -- validate `spice translate` emits stable Tcl.
• Test/spice/spice_v_dc_sweep.tcl — spice_v_dc_sweep.tcl -- .dc sweep validates the supply-mutate mechanism.
• Test/spice/spice_vcvs.tcl — spice_vcvs.tcl -- voltage-controlled voltage source (E line).

unit (15)

• Test/unit/matrix/bcgs-ilu.tcl — Smoke test: 3D PN diode drift-diffusion solved with BiCGSTAB iterative
• Test/unit/matrix/blasbcgs-ilu.tcl — Smoke test: 3D PN diode drift-diffusion solved with BLAS-backed BiCGSTAB
• Test/unit/matrix/common.tcl — Helper: shared 3D PN-diode drift-diffusion deck sourced by the matrix/
• Test/unit/matrix/gmres-ilu.tcl — Smoke test: 3D PN diode drift-diffusion solved with GMRES iterative
• Test/unit/matrix/jacobi.tcl — Smoke test: 3D PN diode drift-diffusion solved with Jacobi preconditioner
• Test/unit/matrix/none-ilu.tcl — Smoke test: 3D PN diode drift-diffusion with ILU preconditioner and no
• Test/unit/matrix/umf.tcl — Smoke test: 3D PN diode drift-diffusion solved with UMFPACK direct LU
• Test/unit/misc/QFvsSG.tcl — Cross-validates quasi-Fermi (Qfn/Qfp) vs Scharfetter-Gummel (Elec/Hole)
• Test/unit/misc/fail.tcl — Negative-control test: asserts the test harness correctly reports failure
• Test/unit/misc/integrate.tcl — Validates that summing per-layer integrals reported by `layers` equals the
• Test/unit/misc/nodedata.tcl — Exercises struct nodedataout/nodedatain field-only I/O: writes Doping,
• Test/unit/misc/optimize.tcl — Tests the `optimize` Tcl proc (gradient-descent-style parameter fit) on a
• Test/unit/misc/pass.tcl — Positive-control test: asserts the test harness correctly reports success
• Test/unit/misc/schro.tcl — Tests the Schrodinger solver on a 1D parabolic confining potential
• Test/unit/utilities/comparestruct.tcl — Exercises field-server comparison: round-trips a 2D grid through struct